MediaTek Unveils Dimensity CX C10 Max 3nm SoC for Fanless Googlebooks

MediaTek has announced the Dimensity CX C10 Max, marking the debut of its new Dimensity Compute Experiences (CX) processor family. Fabricated on TSMC’s second-generation 3nm process node, the flagship processor is designed for premium, ultra-portable laptops and forms the hardware foundation for Google’s newly unveiled Googlebook platform.

The processor represents a strategic departure for MediaTek. Rather than extending its entry-level Kompanio branding traditionally associated with low-cost Chromebooks, the Dimensity CX tier establishes a dedicated high-performance ARM computing line. Armed with an all-big-core CPU architecture, an 11-core Immortalis GPU, and 55 TOPS of on-device neural compute, the C10 Max is engineered to enable thin, completely fanless laptop designs capable of all-day battery life.

All-Big-Core Architecture: Cortex-X925 at 3.73GHz

The Dimensity CX C10 Max moves away from low-power efficiency cores entirely, adopting an All Big Core 8-core CPU cluster designed for sustained multi-threaded computing:

• Prime Performance Core: A single Arm Cortex-X925 core clocked at up to 3.73GHz, backed by 2MB of dedicated L2 cache to drive heavy single-threaded productivity spikes.
• Mid-Performance Cluster: Three Arm Cortex-X4 cores featuring 1MB of L2 cache each to maintain high throughput across intensive background multitasking.
• High-Efficiency Big Cores: Four Arm Cortex-A720 cores with 512KB of L2 cache each, delivering baseline compute without invoking high thermal profiles.
• Massive Cache Hierarchy: The CPU is supported by 12MB of shared L3 cache alongside 10MB of system-level cache (SLC), minimizing off-chip memory requests and conserving battery draw.

55 TOPS NPU 890: Powering On-Device Gemini Agents

At the center of MediaTek’s laptop silicon is its eighth-generation NPU 890, delivering up to 55 TOPS (Tera Operations Per Second) of neural processing capability.

The NPU natively supports INT8, INT16, FP16, and BF16 precision formats, surpassing Google’s minimum hardware requirements for local neural workloads. Rather than offloading AI requests to remote cloud data centers, the processor runs Google’s Gemini Intelligence models directly on the device. This architecture enables zero-latency transcription, real-time context summarization, and always-on “agentic” AI tasks that monitor workflows locally without raising privacy concerns or draining the battery.

MediaTek Dimensity CX C10 Max: Technical Specifications

Hardware Subsystem	Technical Specifications
Manufacturing Process	TSMC 2nd-Gen 3nm Process Node
CPU Architecture	8-Core All Big Core (1× X925 + 3× X4 + 4× A720)
Peak Prime Clock	3.73GHz (Arm Cortex-X925 with 2MB L2 Cache)
Cache Hierarchy	12MB Shared L3 Cache + 10MB System-Level Cache
Graphics Processing	11-Core Arm Immortalis-G925 MC11 GPU
Neural Processing	MediaTek NPU 890 (Up to 55 TOPS)
Memory Interface	LPDDR5X up to 9,600 Mbps
Storage Standard	UFS 4.0 Storage Architecture
Display Outputs	Internal 4K60; Dual External 4K via DisplayPort MST
Camera & ISP	Imagiq 1090 ISP (Up to 32MP with EIS, HDR & Auto-Zoom)
Video Decoding	10-bit 4K60 Decode (AV1, HEVC, AVC, VP9)
Wireless Connectivity	Integrated Wi-Fi 7 (Up to 7.3 Gbps) & Bluetooth 6.0
Thermal Target	Ultra-Thin, Completely Fanless Operation

Graphics, External Displays, and Video Conferencing

To meet desktop-grade multimedia demands, MediaTek integrated its 11-core Arm Immortalis-G925 MC11 GPU, delivering hardware-accelerated ray tracing and high-frame-rate rendering for creative workloads and casual gaming:

• Dual 4K Display Engines: The display pipeline can power an internal 4K panel at 60Hz while driving dual external 4K monitors over DisplayPort Multi-Stream Transport (MST).
• Advanced AV1 Decoding: MediaTek includes 10-bit 4K60 video decoding across AV1, HEVC, AVC, and VP9 codecs, enabling efficient video playback without stressing the CPU cores.
• Imagiq 1090 ISP: Built-in webcams receive a major upgrade via support for up to 32MP sensors. The ISP incorporates hardware-level Electronic Image Stabilization (EIS), high dynamic range (HDR) exposure correction, and continuous face-tracking auto-zoom to maintain sharp framing during virtual meetings.

Memory Bandwidth and Next-Gen Connectivity

The C10 Max adopts LPDDR5X memory running up to 9,600 Mbps, paired with high-speed UFS 4.0 solid-state storage. This high-bandwidth memory interface ensures that large language models (LLMs) load into working memory with minimal delay, resolving one of the primary performance bottlenecks on ARM-based notebooks.

On the networking front, the platform integrates Wi-Fi 7, delivering theoretical peak wireless transfer speeds of up to 7.3 Gbps. It is accompanied by a dual-engine Bluetooth 6.0 controller designed to minimize audio latency and provide rock-solid connection stability for wireless earbuds, styluses, and external keyboards.

Market Positioning: Powering Googlebook Laptops

The Dimensity CX C10 Max is designed to challenge the dominance of Qualcomm’s Snapdragon X platform and Intel’s Core Ultra chips in the power-efficient PC segment.

MediaTek confirmed that the chip will make its retail debut inside an upcoming Lenovo Googlebook. By pairing TSMC’s 3nm lithography with an efficient fanless thermal ceiling and up to 19 hours of battery life, MediaTek’s new silicon is positioned to give Google’s enterprise and consumer PC ecosystem a strong competitor against Apple’s MacBook Air lineup.