Tag Archives: qualcomm

Samsung Manufactures 7nm A12 Chipsets for Next Year’s iPhone

Samsung Manufactures 7nm A12 Chipsets for Next Year’s iPhone

This is a big win for Samsung, to build 7nm A12 chips for the 2018 iPhone according to The Korea Herald. Considering it lost the deal for the Snapdragon 845 to TSMC whom currently makes the 10nm A11 chip for Apple. The reason for losing out on the Qualcomm deal is because it won’t be ready for 7nm production yet by the time Qualcomm needs them.

A new iPhone is usually released in the 3rd quarter, Samsung would have enough time to prepare for production. The Korean electronics giant just purchased some extreme UV machines specifically to make Apple’s 7nm chips. Testing is ongoing and will soon be completed. Production will then begin after Apple’s approval.

The Qualcomm deal is a loss considering 40% of Samsung Foundry’s sales last year was from the American company. Though there are speculations that Samsung may get deals for mid-range 10nm chips. Some manufacturers may also still release Snapdragon 835 phones next year.

Samsung will first make 8nm chips before making a complete transition to 7nm. Its next Exynos flagship is expected to be built on the 8nm node.

(Source, 1)

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Qualcomm Files Patent Infringement Complaints Against Apple

Qualcomm Files Patent Infringement Complaints Against Apple

Today, Qualcomm has officially registered a complaint with the International Trade Commission (ITC) and Federal Court in the U.S. to import the ban of some iPhones claiming that Apple is unfairly using its technology.

According to the complaint filed by Qualcomm with ITC, iPhones that are manufactured in China should not be imported to the U.S. if they are infringing the patents of Qualcomm. The case filed with US District Court for Southern California seeks damages for patent infringement.

The U.S. based chip maker has accused of Apple of infringing six of its technology patents that belong to some of the important features of iPhones. Qualcomm claims that Apple is continuously using these patents without paying for them. As of this writing, there is no information on which iPhones are infringing Qualcomm’s patents. Hence, the chipset making company is gunning to various operations of Apple such as selling, advertising, importing, warehousing of the iPhone.

The six patents that Apple is said to be violating are related to the optimized performance of the battery, prolonging battery life while sending live video by creating data super-highway, network management, and system performance. All the six patents were issued in the last four years. The images in this post are from Qualcomm which gives a breakdown of all the six patents along with details on each one of them that are being violated by Apple iPhones.

In April, Apple had filed a legal complaint against Qualcomm for unfairly charging patent licensing fees. The complaint stated that the U.S. chip maker is asking the Cupertino company to pay five times more money than it is collectively paying to cellular patent licensors. Apple has also said that the illegal business practices of Qualcomm are not negatively impacting it but also the entire industry.

According to Apple, Qualcomm is only supplying it with a single connectivity component that does not belong to any of the innovations of Apple that it uses on its iPhones and still it is demanding a percentage of the collective cost of its products. At the same time, Qualcomm has also said that Apple is spreading false and misleading information to antitrust agencies in a bid to decrease the royalty amount that it is to pay to Qualcomm.

(Source, 1)

Vivo shows Prototype of Full-Screen Phone with New “Under Display” Fingerprint Sensor

Vivo shows Prototype of Full-Screen Phone with New “Under Display” Fingerprint Sensor

The Mobile World Congress Shanghai 2017 began on June 28 and it began with a bang. BBK subsidiary Vivo took the center stage when it showcased a prototype of its latest full-screen phone which comes with a spectacular “under display” fingerprint sensor.

The fingerprint technology is actually developed by Qualcomm as a successor to its ultrasonic fingerprint technology unveiled last year. Vivo happens to have provided the prototype smartphone on which it is first being featured. The prototype is a modified version of the Vivo XPlay 6 with the under display fingerprint technology located beneath the 1.2mm thick OLED display panel. The new fingerprint scanner uses Qualcomm’s new ultrasonic technology which sends a pulse through the finger, some of which gets reflected while some get absorbed. These vibrations are then detected by a sensor which builds up a fingerprint.

Apart from penetrating the 1.2mm thick OLED, the sensor is said to be capable of penetrating a 0.8mm glass, and 0.525mm metal which is a great improvement over capacitive fingerprint sensor. Capacitive fingerprint sensor cannot function effectively under wet hands and in dusty conditions. But the new technology is reputed to function well under wet hands or dust.

Qualcomm’s new ultrasonic solution will ship to OEMs in two forms. The Fingerprint Sensors for Glass and Metal will reportedly start shipping to OEMs this month and will only work with Snapdragon 660 and 630 processors while the fingerprint sensors for display will start finding its way into smartphones in the fourth quarter of the current year and will work with non-Snapdragon chip packing smartphones as well. The video demo of the under display fingerprint technology can be watched from below.

Qualcomm Develops Under-Display Fingerprint Scanner

Qualcomm Develops Under-Display Fingerprint Scanner

At Mobile World Congress Shanghai 2017, Qualcomm Technologies, Inc., a subsidiary of Qualcomm Incorporated (NASDAQ: QCOM), today announced Qualcomm® Fingerprint Sensors, next-generation ultrasonic fingerprint solutions which bring new and enhanced features to the previous generation Qualcomm® Snapdragon Sense™ ID fingerprint technology.

The chip manufacturer announced that it is working on making under-display sensors and is even already making samples. This scanner will be able to sit under OLED panels that are up to 1200µm thick.

An image provided by Qualcomm shows that their scanners will cut across three main categories:

  1. Under-display scanners will be used for premium phones.
  2. Under-metal and glass scanners will be used for high-end phones and will be able to scan through the glass of up to 800 µm or aluminum of up to 650µm.
  3. Under-glass scanners for mid and low tier phones that can scan through glass 800µm thick.

Qualcomm said the Scanners for Metal and Glass will be compatible with the new Snapdragon 630 and Snapdragon 660 mobile platforms while the Scanners for Display, Glass & Metal are designed to be compatible with future Snapdragon 800 series, 600 series, 400 series, and 200 series mobile platforms. They will also work with non-Snapdragon processors and as standalone sensors.

Qualcomm says their scanners will be able to detect fingerprints underwater and also heart beat and blood flow for a more secure authentication.

The highlight of the announcement is the partnership with Vivo. Qualcomm says it is working with the Chinese manufacturer and will display modified versions of the Xplay6 sporting Qualcomm Fingerprint Sensors for Display at the Shanghai Mobile World Congress.

Qualcomm has released a time-frame for when the scanners will hit markets:

  • Commercial samples of Fingerprint Scanners for Glass and Metal will ship out to OEMs in July 2017
  • Engineering samples of Fingerprint Sensor for Display will be received in October 2017.
  • Commercial samples of Fingerprint scanners for display are expected in early 2018.
  • Commercial devices with Fingerprint Scanners for Glass and Metal are expected to launch in early 2018
  • Commercial devices with Fingerprint Scanners for Display are expected to launch in Summer 2018.


Qualcomm Snapdragon 450 Chipset is Official

Qualcomm Snapdragon 450 Chipset is Official

Qualcomm has today introduced a new family member to its Snapdragon 400 mobile platform – the all new Snapdragon 450 the successor of the Snapdragon 435 chipset. The new Snapdragon SoC has been unveiled at the Mobile World Congress Shanghai 2017 event.

Snapdragon 450 Specifications:

The Snapdragon 450 chipset is the first Snapdragon 400 series SoC to be built with 14nm FINFET manufacturing processor. The chipset is made for powering mid-range smartphones.  It is an octa-core chipset featuring four Cortex A53 cores working 1.8 GHz and another set of four Cortex A53 cores gunning at 1.8 GHz. It includes Adreno 506 graphics which is also present inside Snapdragon 625.

It supports one 32-bit LPDDR3 RAM. Its dual ISP can support a pair of 13-megapixel camera sensors. It can support a max of 21-megapixel single camera. It can encode 1080p content and decode H.264 and HVEC media. For data connectivity, its Cat. 7 X9 LTE modem that makes use of 2x20MHz carrier aggregation. It supports USB 3.0 that brings support for Quick Charge 3.0.

Snapdragon 450 Features:

Enhanced CPU and GPU Performance-

The Snapdragon 450 offers 25 percent better computing performance than its predecessor. Also, it churns 25 percent increase in GPU performance than SD 435.

Better Battery Performance-

The Snapdragon 450 brings up to four hours of extra battery usage time than Snapdragon 435. It consumes 30 percent less power while playing games. The support for Quick Charge 3.0 allows a Snapdragon 450 phone to charge from zero to 80 percent in around 35 minutes.

Camera and Multimedia-

The Snapdragon 450 powered mid-range phones are capable of supporting real-time bokeh effect. It allows users to record 1080p (Full HD) videos at 60 fps. It also supports slow motion capture. The SD 450 chip supports 1,920 x 1,080 screens along with Hexagon DSP which brings improved performance for camera and multimedia.

Connectivity and USB-

The Snapdragon 450 is the first Snapdragon 400 series chipset to feature Snapdragon X9 LTE modem that delivers 300 Mbps download speeds and 150 Mbps upload speeds. It supports wide range mobile networks through Snapdragon All Mode. It also carries support Wi-Fi 802.11ac along with MU-MIMO. It is also the first in Snapdragon 400 series to feature USB 3.0 for speedier data transfer.

The commercial sampling of Snapdragon 450 is pegged to begin in the third quarter of 2017. Hence, the Snapdragon 450 enabled devices are expected to reach consumers by the end of 2017.

(Source, 1)

Samsung Galaxy S9 comes with 7nm Snapdragon & 8nm Exynos Chipset

Samsung Galaxy S9 comes with 7nm Snapdragon & 8nm Exynos Chipset

A new report states that Samsung may employ 7nm Qualcomm chipset as well as 8nm Exynos chipsets on its upcoming Galaxy S9 flagship that will debut next year.according to a South Korean publication, the South Korean company has lost the manufacturing order of the next-generation 7nm Snapdragon chipset to TSMC earlier this year.

According to a South Korean publication, the South Korean company has lost the manufacturing order of the next-generation 7nm Snapdragon chipset to TSMC earlier this year. The publication has further reported that Samsung will be using 8nm manufacturing process for its next-generation Exynos chipset. The reason behind it is that Samsung is still prepping for the production of the 7nm chipset. However, Qualcomm seems to be having an upper hand as it next-generation chipset that is rumored as Snapdragon 845 will be built with 7nm manufacturing technology. It is said to be more power-efficient and cost-effective than the 8nm chipset.

According to the publication, an industry insider has said that Samsung is likely to the next-generation 7nm Snapdragon SoC built by TSMC because of its energy efficiency and performance. Another report from the same publication states that Samsung will significantly reduce the production of the 7nm chipset in a bid to begin the production 6nm chipset in 2019. There are some rumors that the 7nm Exynos chipset will be present under the hood of Galaxy Note 9.

(Source, 1)

Qualcomm collaborating with Bosch Sensortec, OmniVision & Ximmerse

Qualcomm collaborating with Bosch Sensortec, OmniVision & Ximmerse

Qualcomm has made an official announcement on collaborating with three companies to fulfill its mobile VR goals. The three companies with which Qualcomm has entered a partnership are Bosch Sensortec, OmniVision, and Ximmerse.

Bosch Sensortec’s BMX055 orientation sensor will be used in Head Mounted Display (HMD) Accelerator Program by Qualcomm. It includes various kinds of sensors such as accelerometer, gyroscope, and magnetometer.

The U.S. based chip maker will be using OmniVision’s 1-megapixel OV9282 image sensor enabled with a high-speed shutter in HMD Accelerator Program (HAP). It will be also equipped with Ximmerse’s controllers that are optimized for use with Qualcomm’s Snapdragon chipsets for mobile devices. Also, the Flip controllers from Ximmerse will deliver lower latency and drift-free tracking with accurate precision.

The program provides VR OEMs with reference products, tools and other resources that can help them to release VR hardware in short time. The Virtual Reality Development Kit and VR reference headset that is based on Snapdragon 835 are some items that are provided as resources to OEMs.

In China, many Snapdragon 820 VR HMD reference design based standalone VR HMDs are already available. More HAP-based VR headsets are expected to launch in the near future. During the Google I/O 2017 event that was held in May, Google and Qualcomm had come together to announce a new standalone VR headset driven by Snapdragon 835 that is poised to release by the end of 2017. It is based on the reference design from Qualcomm.

HTC and Lenovo are also expected to announce standalone headsets enabled with Daydream VR. Again, these VR headsets are going to be based on Qualcomm’s reference design and will be powered by Snapdragon chipset.